> DDR4 functionality and operations supported as defined in the component data sheet

> 288-pin, registered dual in-line memory module (RDIMM)

> Fast data transfer rate: PC4-3200, PC4-2933, or PC4-2666

> 128GB (16 Gig x 72)

> V DD = 1.20V (NOM)

> V PP = 2.5V (NOM)

> V DDSPD = 2.5V (NOM)

> Supports ECC error detection and correction

> Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

> Low-power auto self refresh (LPASR)

> On-die V REFDQ generation and calibration

> Two package ranks x four logic ranks

> On-board I 2 C temperature sensor with integrated serial presence-detect (SPD) EEPROM

> 32Gb, 3DS 4-high die stack x4 package, Master/Slave control logic. Each die with16 internal banks; 4 groups of 4 banks each

> Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)

> Selectable BC4 or BL8 on-the-fly (OTF)

> Gold edge contacts

> Halogen-free

> Fly-by topology

> Terminated control, command, and address bus